Mcob packaging materials and technology for LED in

Mcob packaging materials and technology for LED indoor lighting in China

on January 31, at the achievement appraisal meeting of "low-cost and high-efficiency improved mcob packaging materials and technology integration for LED indoor lighting" held by the Chinese Academy of Sciences in Putian, Fujian Province, the expert group of the appraisal committee agreed that the technology has complete independent intellectual property rights, has realized large-scale industrialization, and the technical indicators of the products have reached the international advanced level. On January 31, at the appraisal meeting of low-cost and high-efficiency improved mcob packaging materials and technology integration achievements for LED indoor lighting held by the Chinese Academy of Sciences in Putian, Fujian, the expert group of the appraisal committee agreed that the technology has complete independent intellectual property rights, has realized large-scale industrialization, and the technical indicators of the products have reached the international advanced level

the expert group agreed that after long-term basic research and engineering application research, through the design and development of packaging key materials, this achievement has formed an innovative integration technology of improved multi-function, multi cup and multi chip (mcob) packaging based on new materials, significantly improved light efficiency, effectively reduced costs, made major breakthroughs in key materials and key technologies, and has independent intellectual property rights, And has achieved large-scale industrialization

since 2009, Fujian Institute of material structure of Chinese Academy of Sciences has cooperated with Fujian Wanbang Photoelectric Technology Co., Ltd. to jointly carry out the research and development of mcob packaging material and structure industrialized manufacturing technology. Now, the luminous efficiency of its developed lamp products has reached the international advanced level, and the price is only 30% of that of similar products in the market. In 2012, the technology has achieved an annual output of 1.5 million LED bulb lamps and 1 million LED fluorescent lamps

the expert group believes that this achievement has formed a complete independent intellectual property right from packaging materials to packaging structure, mainly including four innovative technologies:

first, designed and developed a multifunctional high reflectivity optical ceramic film aluminum substrate. As the mcob packaging substrate material, it solves the common problem of silver film yellowing, breaks through the insulation and heat conduction barrier, improves the substrate reflectivity and light efficiency of light source, and simplifies the packaging structure, The total cost of lamps is reduced by more than one quarter. The mcob packaging technology of the substrate is applied to realize the test range of LED bulb lamp. Generally, the maximum experimental force is the upper limit, and the downward compatibility with the whole light efficiency is 153.4: if the machine is not used for a long time after the experiment, the color rendering index is 82.8, the whole light efficiency of LED fluorescent lamp strip is 154.72lm/w, and the color rendering index is 70.2

II. Taking the lead in developing alumina composite ceramic substrate by tape casting composite lamination process, which realizes the combination of high diffuse reflection and high thermal conductivity, high electrical breakdown resistance, high reliability and other advantages, effectively improves the light efficiency and light quality of light source, and solves the problem of low reflection and low thermal conductivity of ordinary alumina ceramic substrate. Using the composite ceramic substrate mcob packaging technology, the whole light efficiency of LED bulb lamp is 149.97lm/w, the color rendering index is 82.5, the whole light efficiency of LED fluorescent lamp strip is 141.2lm/w, and the color rendering index is 69.8

III. through innovative process and crystal field modulation technology, a new generation of transparent ceramic phosphor with garnet structure of fluorescent material with adjustable luminous wavelength, no surface defects, high quantum efficiency, low light attenuation and transmittance close to the theoretical value is prepared. The new transparent ceramic phosphor is used for mcob packaging, which significantly improves the reliability and luminous efficiency of light source, simplifies the packaging structure and reduces the cost, It solves the common problems of color drift and light decay caused by the aging of phosphor and packaging adhesive. Meanwhile, the double faced light emitting package structure was first put forward and used. The light source efficiency of the multi chip package structure was realized under low current driving. 261 kinds of phenolic foam preparation were introduced two days ago. The 1 way was to prepare phenolic foam Lm/W by heating method. p>

IV. adopt improved mcob technology integration (including the above three substrate packaging technologies and chip post-processing technology, power supply technology, ceramic heat dissipation fin technology, high thermal conductivity primer technology, etc.) to form low-cost and high-efficiency LED light source packaging and lamp technology. The cost of LED products is reduced by more than one quarter, the efficiency is increased by 50%, and the performance index is internationally leading

the expert group suggested that it is necessary to further accelerate the promotion and application of technology, especially the industrial application of transparent fluorescent ceramic technology, and expand the industrial scale, so as to enhance the core competitiveness of China's LED lighting industry